Light emitting element

ABSTRACT

A light emitting element includes a semiconductor laminate structure including a first semiconductor layer of a first conductivity type, a light emitting layer, and a second semiconductor layer of a second conductivity type different from the first conductivity type, a part of the second semiconductor layer and the light emitting layer being removed to expose a part of the first semiconductor layer: a first reflecting layer on the semiconductor laminate structure and including an opening, the opening being formed in the exposed part of the first semiconductor layer, a transparent wiring electrode for carrier injection into the first semiconductor layer or the second semiconductor layer through the opening, a second reflecting layer formed on the transparent wiring electrode and covering a part of the opening so as to reflect light emitted from the light emitting layer and passing through the opening back to the first semiconductor layer.

The present application is based on Japanese patent applicationNos.2010-190779 and 2011-128390 tiled on Aug. 27, 2010 and June 8, 2011.respectively, the entire contents of which are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. FIELD OF THE INVENTION

This invention relates to a light emitting element with a structure toreflect light emitted therein in a light extracting direction thereof

2. DESCRIPTION OF THE RELATED ART

Heretofore, a light emitting element of a Clip-chip type in which ap-type electrode and an n-type electrode are formed in the same surfaceof a nitride semiconductor formed on a sapphire substrate is known (forexample. JP-A-2008-288548). The light emitting element disclosed inJP-A-2008-288548 has a light emitting layer between a p-typesemiconductor layer and an n-type semiconductor layer, and a diffusionelectrode having translucency composed of Indium Tin Oxide (ITO) or thelike is formed on the p-type semiconductor layer. A buffer electrodeobtained by stacking Ni and Al in order and then heating so as to alloyis formed on the diffusion electrode. In addition, a metallic reflectingfilm for reflecting a light emitted from the light emitting layer andhaving passed through the diffusion electrode is formed in a part abovethe diffusion electrode other than the buffer electrode.

SUMMARY OF THE INVENTION

The light emitting element disclosed in JP-A-2008-288548 may operatesuch that a part of light emitted from the light emitting layer andpassing through the diffusion electrode is reflected by the metallicreflecting film, but the other part of the light is absorbed by thebuffer electrode or n-electrode. Therefore. the light emitting elementis limited in the enhancement of light extraction efficiency.

Accordingly, it is an object of the invention to provide a lightemitting element that can be enhanced in the light extraction efficiencyin extracting a light emitted from a light emitting layer thereof.

(1) According to one embodiment of the invention, a light emittingelement comprises:

a semiconductor laminate structure comprising a first semiconductorlayer of a first conductivity type, a light emitting layer, and a secondsemiconductor layer of a second conductivity type different from thefirst conductivity type, a part of the second semiconductor layer andthe light emitting layer being removed to expose a part of the firstsemiconductor layer;

a first reflecting layer on the semiconductor laminate structure andcomprising an opening, the opening being formed in the exposed part ofthe first semiconductor layer;

a transparent wiring electrode for carrier injection into the firstsemiconductor layer or the second semiconductor layer through theopening; and

a second reflecting layer formed on the transparent wiring electrode andcovering a part of the opening so as to reflect light emitted from thelight emitting layer and passing through the opening back to the firstsemiconductor layer.

In the above embodiment (1) of the invention. the followingmodifications and changes can be made.

(i) The light emitting element further comprises:

a contact electrode comprising a transparent conducting layer, onesurface of which contacts the transparent wiring electrode and an othersurface of which contacts the first semiconductor layer or the secondsemiconductor layer.

(ii) The contact electrode comprises a same electrode material as thetransparent wiring electrode.

(iii) The first reflecting layer is formed on a part of the contactelectrode of the first semiconductor layer or the second semiconductorlayer.

(iv) The light emitting element further comprises:

an insulating layer formed in between the first reflecting layer and thesecond reflecting layer and/or in between the first reelecting layer andthe transparent wiring electrode.

(v) The light emitting element further comprises:

a metallic wiring electrode formed at a region on the first reflectinglayer and except the opening, and electrically connected to thetransparent wiring electrode.

(vi) The first reflecting layer comprises a contact electrode of thesecond semiconductor layer.

(vii) The transparent wiring electrode contacts the first semiconductorlayer.

(viii) A contact electrode of the first semiconductor layer comprises atransparent conducting layer, and the transparent wiring electrodecontacts the transparent conducting layer.

(ix) The light emitting element is of a flip-chip type so as to extractlight emitted from the light emitting layer in a direction of across thesemiconductor laminate structure from the first reelecting layer or thesecond reflecting layer.

Points of the Invention

According to one embodiment of the invention. a light emitting elementis constructed such that a contact electrode on a p-side contact layerof a p-type semiconductor layer is formed of ITO transparent to lightemitted from an active layer thereof, a first reflecting layer is formedthereon, and a second reflecting layer is formed on a p-side firstinsulating film opening of the first reflecting layer in which a p-sidetransparent wiring electrode layer is disposed. Thereby, the emittedlight can be reflected back to the light extracting direction at a highrate without being absorbed by the p-side transparent contact electrode.so that the light extraction efficiency of the light emitting elementcan be enhanced.

BRIEF DESCRIPTION OF THE DRAWINGS

The preferred embodiments according to the invention will be explainedbelow referring to the drawings, wherein:

FIG. 1 is a plan view schematically showing a structure of a lightemitting element according to a first embodiment of the presentinvention:

FIG. 2A is a cross-sectional view taken along the line A-A in FIG. 1:

FIG. 2B is a partial enlarged view of FIG. 2A:

FIGS. 3A to 3I are plan views schematically showing one step in amanufacturing process of the light emitting element according to thefirst embodiment of the present invention:

FIG. 4 is a plan view schematically showing a structure of a lightemitting element according to a second embodiment of the presentinvention: and

FIG. 5 is a plan view schematically showing a structure of a lightemitting element according to a third embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment

Structure of Light Emitting Element 1

FIG. 1 is a plan view schematically showing a structure of a lightemitting element according to a first embodiment of the presentinvention. FIG. 2A is a cross-sectional view taken along the line A-A inFIG. 1 and FIG. 2B is a partial enlarged view of FIG. 2A.

As shown in FIG. 1. the light emitting element 1 according to the firstembodiment of the present invention is of a flip-chip type one and isformed so as to have a rectangular shape in a plan view. In addition, asshown in FIG. 2A. the light emitting element 1 includes a sapphiresubstrate 10 having a c-plane (0001). and a GaN semiconductor layer 20formed on the sapphire substrate 10. The GaN semiconductor layer 20 hasa buffer layer (not shown), an n-type semiconductor layer 21 formed onthe buffer layer. a light emitting layer 22 formed on the n-typesemiconductor layer 21 and a, p-type semiconductor layer 23 formed onthe light emitting layer 22 in this order from the side of sapphiresubstrate 10.

In addition. the light emitting element 1 includes a p-side transparentcontact electrode 30 formed on the p-type semiconductor layer 23. afirst reflecting layer 50 for reflecting a light emitted from the lightemitting layer 22. and a p-side transparent wiring electrode layer 40for injecting carriers into the p-type semiconductor layer 23. As shownin FIG. 2A. One surface of the p-side transparent contact electrode 30comes into contact with the p-side transparent wiring electrode layer 40and another surface thereof comes into contact with the p-typesemiconductor layer 23. The first reflecting layer 50 is formed on thep-side transparent contact electrode 30 and a p-side first insulatingfilm opening 55 is formed in a part of the first reelecting layer 50. Inaddition, the first reelecting layer 50 is constructed such that areflecting layer 52 is covered with an insulating film 51. The p-sidetransparent wiring electrode layer 40 is formed on the first reflectinglayer 50, and comes into contact with the p-side transparent contactelectrode 30 via a p-side first insulating film opening 55 formed in thefirst reflecting layer 50 so as to be electrically connected to thep-side transparent contact electrode 30.

Also, the light emitting element 1 includes a p-side wiring electrodelayer 70, a second reflecting layer 60 for reflecting the light emittedfrom the light emitting layer 22, and a p-side electrode 80. The p-sidewiring electrode layer 70 is formed in a region located on the p-sidetransparent wiring electrode layer 40 but not located above the p-sidefirst insulating film opening 55, and is electrically connected to thep-side transparent wiring electrode layer 40. The second reflectinglayer 60 has a reflecting layer 62 formed so as to cover at least a partof the p-side first insulating film opening 55 above the p-sidetransparent wiring electrode layer 40, and is formed on the p-sidetransparent wiring electrode layer 40 and the p-side wiring electrodelayer 70. The reflecting layer 62 is formed so as to reflect the lightof the emitting layer 22 having passed through the p-side firstinsulating film opening 55 toward the light emitting layer 22. Inaddition. the second reflecting layer 60 is constructed such that thereflecting layer 62 is covered with the insulating film 61. The p-sideelectrode 80 is formed on the second reflecting layer 60 and comes intocontact with the p-side wiring electrode layer 70 exposed from thep-side second insulating film opening 65 formed in the second reflectinglayer 60 so as to be electrically connected to the p-side wiringelectrode layer 70.

In addition. the light emitting element 1 includes a n-side transparentwiring electrode layer 41 for injecting carriers into the n-typesemiconductor layer 21. a n-side wiring electrode layer 71 and an n-sideelectrode 81. The n-side transparent wiring electrode layer 41 is formedin the upper side of the first reelecting layer 50 on the n-typesemiconductor layer 21 exposed by that from the p-type semiconductorlayer 23 to at least a part of the contact layer of the n-typesemiconductor layer 21 are removed by etching, and comes into contactwith the n-type semiconductor layer 21 via the n-side first insulatingfilm opening 56 formed in the first reflecting layer 50 so as to beelectrically connected to the n-type semiconductor layer 21. The n-sidewiring electrode layer 71 is formed in a region located on the n-sidetransparent wiring electrode layer 41 but not located above the n-sidefirst insulating film opening 56. and is electrically connected to then-side transparent wiring electrode layer 41. Also, a reelecting layer62 of the second reflecting layer 60 is formed so as to cover at least apart of the upper part of the n-side first insulating film opening 56.The n-side electrode 81 is formed on the second reflecting layer 60 soas to be electrically connected to the n-side wiring electrode layer 71exposed from the n-side second insulating film opening 66 formed in thesecond reflecting layer 60.

In the embodiment. a mesa portion including the p-type semiconductorlayer 23. the light emitting layer 22 and the n-type semiconductor layer21 is formed by that from the p-side contact layer of the p-typesemiconductor layer 23 to a part of n-side contact layer of the n-typesemiconductor layer 21 are removed. The mesa portion is formed by thatthe GaN semiconductor layer 20 is removed in such a way that a part ofthe n-type semiconductor layer 21 remains. and has an inclined surfaceinclined to a direction perpendicular to the sapphire substrate 10. Thefirst reflecting layer 50 including the reflecting layer 52 is formed onthe inclined surface, and the n-side transparent wiring electrode layer41 is formed on the first reflecting layer 50., In addition, in theembodiment. the reflecting layer 52 is also formed in the outer edgeportion of the light emitting element 1 p-side transparent wiringelectrode layer 40.

Each of the n-side contact layer and n-side clad layer constituting then-type semiconductor layer 21, the light emitting layer 22. and thep-side clad layer and p-side contact layer constituting the p-typesemiconductor layer 23 is a layer including a III-group nitride compoundsemiconductor. As the III-group nitride compound semiconductor includes,for example. a III-group nitride compound semiconductor ofAl_(x)Ga_(y)In_(1−x−y)N (0≦x≦1,0≦y≦1,0≦x+y≦1) can be used.

The light emitting layer 22 includes a plurality of quantum xvell layersand barrier layers and has a multiple quantum well structure for whichmaterials such as InGaN. GaN.

AlGaN are used. In addition, each of the p-side clad layer and p-sidecontact layer is formed of p-GaN doped with a predetermined amount ofp-type dopant such as Mg.

In the embodiment. a material constituting the p-side transparentcontact electrode 30 and materials constituting the p-side transparentwiring electrode layer 40 and n-side transparent wiring electrode layer41 include the same electrode material respectively. In addition amaterial constituting the p-side wiring electrode layer 70 and amaterial constituting then-side wiring electrode layer 71 include thesame electrode material respectively.

The p-side transparent contact electrode 30, p-side transparent wiringelectrode layer 40 and n-side transparent wiring electrode layer 41include a material having conductive property and translucency to awavelength of a light emitted from the light emitting layer 22. In theembodiment, the p-side transparent contact electrode 30, p-sidetransparent wiring electrode layer 40 and n-side transparent wiringelectrode layer 41 are formed of an oxide semiconductor, for example,Indium Tin Oxide (ITO). In addition, the insulating films 51, 61 includea material having electrical insulation property and translucency to awavelength of a light emitted from the light emitting layer 22. Theinsulating films 51, 61 are mainly formed of, for example, silicon oxide(SiO₂).

Also, each of the reflecting layers 52, 62 is formed inside of theinsulating films 51, 61, and is formed of a metal material reflecting alight emitted from the light emitting layer 22 such as Al, Ag, Rh, Pt,Pd. It is preferable that the insulating films 51, 61 have a thicknessof not less than 0.1 μm and not more than 1.0 μm throughout, and thereflecting layers 52, 62 formed inside of the insulating films 51, 61have a thickness of not less than 0.05 μm and not more than 0.5 μm forthe purpose of reflecting a light having entered the reflecting layers52, 62 appropriately.

The p-side wiring electrode layer 70 and n-side wiring electrode layer71 are formed of, for example, a metal material or the like including Nior Ti, and a metal material or the like including Au. In case that thep-side wiring electrode layer 70 and n-side wiring electrode layer 71are formed of a layer including Ni or Ti and an Au layer, it ispreferable that the Au layer has a thickness of not less than 0.05 μm.

In addition. a solder layer can be formed on the p-side electrode 80 andn-side electrode 81. and the solder layer can be formed of an eutecticmaterial such as AuSn. The solder layer can be formed by, for example,vacuum deposition method such as electron beam deposition method,resistance heating deposition method, sputtering method, plating method,screen printing method and the like. In addition, the solder layer canbe also formed of an eutectic solder of an eutectic material other thanAuSn or a lead-free solder such as SnAgCu.

The light emitting element 1 constructed as above is a light emittingdiode (LED) of a Clip-chip type that emits a light having a wavelengthof blue region, and for example, the light emitting element 1 emits alight having a peak wavelength of 455 nm in case that forward voltage is2.9 V and forward current is 20 mA. The light emitting element 1 has aplanar dimension that, for example, the longitudinal dimension andtransverse dimension are about 300 μm and 500 μm respectively.

Further. each layer from the butler layer to the p-side contact layerformed on the sapphire substrate can be formed by, for example, MetalOrganic Chemical Vapor

Deposition (MOVD) method, Molecular Beam Epitaxy (MBE) method. HalideVapor Phase Epitaxy (HVPE) method and the like respectively. Here, acase that the buffer layer is formed of AIN has been exemplified. butthe buffer layer can be also formed of GaN. In addition. the quantumwell structure of the light emitting layer 22 is not limited to themultiple quantum well structure, but single quantum well structure andstrained quantum well structure can be also used.

In addition, the insulating films 51, 61 can be also formed of a metaloxide such as titanium oxide (TIO₂), alumina (Al₂O₃), tantalumpentoxide. or a resin material having electrical insulation propertysuch as polyimide. Also. the reflecting layers 52, 62 can be also formedof Ag or an alloy including Al or Ag as a main component. In addition,reflecting layers 52, 62 can also be Distributed Bragg Reflector (DBR)formed of a plurality of layers of two materials different from eachother in refractive index

Furthermore. the light emitting element 1 can also be a LED emitting alight having a peak wavelength in ultraviolet region, near-ultravioletregion or green region, but the region of the peak wavelength of thelight emitted from the LED is not limited to the above-mentionedregions. Further, in the other modifications, the planar dimension ofthe light emitting element 1 is not limited to the above-mentioneddimension. For example. the planar dimension of the light emittingelement 1 can be also designed so as to set the longitudinal andtransverse dimensions to be 1000 μm respectively, and so as to set themto be different from each other.

Manufacturing Process of Light Emitting Element 1

Next, a manufacturing process of the light emitting element 1 will beexplained. First, the sapphire substrate 10 is prepared, and the GaNsemiconductor layer 20 including the n-type semiconductor layer 21, thelight emitting layer 22 and the p-type semiconductor layer 23 is formedon the sapphire substrate 10. In particular, the buffer layer, then-side contact layer, the n-side clad layer, the light emitting layer22, the p-side clad layer, and the p-side contact layer are epitaxiallygrown on the sapphire substrate 10 in this order so as to form the GaNsemiconductor layer 20 (Semiconductor layer forming step).

FIGS. 3A to 3I are plan views schematically showing one step in amanufacturing process of the light emitting element according to thefirst embodiment of the present invention. and for the purposes ofillustration. each of the FIGS. 3A to 3I shows only a layer formed onthe uppermost surface in each of the manufacturing steps. First. thep-side transparent contact electrode 30 is formed on the whole surfaceof the GaN semiconductor layer 20. Then. as shown in FIG. 3A. the p-sidetransparent contact electrode 30 is patterned by photolithography andetching (e.g. wet etching) to expose the p-type semiconductor layer 23at regions (i.e.. circular regions in FIG. 3A) for forming the n-sidefirst insulating film openings 56 later. In the embodiment. the p-sidetransparent contact electrode 30 is composed of ITO. and can be formedby, for example, a sputtering method, a vacuum deposition method. a CVDmethod, a sol-gel process or the like.

Then, as shown in FIG. 3B. most part of the exposed p-type semiconductorlayer 23 within the circular regions is etched by photolithography andetching so as to vertically remove the p-side contact layer of thep-type semiconductor layer 23 down to a part of the n-side contact layerof the n-type semiconductor layer 21. Thus, the mesa portion composed ofthe plural compound semiconductor layers, i.e., from the n-side contactlayer to the p-side contact layer is formed such that a part of then-side contact layer is exposed. Then. the insulating film 51 of thefirst reflecting layer 50 is formed throughout the surface. Inparticular, the insulating film 51 is formed so as to cover the exposedportions of the p-side transparent contact electrode 30, the mesaportion. and the n-side contact layer. The insulating film 51 can beformed by, for example, a plasma CVD method or a deposition method(First insulating layer forming step in insulating layer forming step).

Also, as shown in FIG. 3C. the reflecting layer 52 of the firstreflecting layer 50 is formed by using the deposition method and thephotolithography technique in a region on the insulating film 51 otherthan a part in which the p-side first insulating film opening 55 and then-side first insulating film opening 56 are formed (First reflectinglayer forming step in insulating layer forming step).

Then, the insulating film 51 is formed again by the plasma CVD method orthe deposition method throughout the surface (Second insulating layerforming step in insulating layer forming step). Hereby, the reflectinglayer 52 is covered with the insulating film 51. Then, as shown in FIG.3D. patterning is applied to the insulating film 51 and the reflectinglayer 52 so as to form the p-side first insulating film opening 55 andthe n-side first insulating film opening 56. In the embodiment, eightthe p-side first insulating film openings 55 are formed in the outeredge side of the GaN semiconductor layer 20 in a plan view. In addition,three the n-side first insulating film openings 56 are formed in thecenter portion of the GaN semiconductor layer 20 in a plan view.

Then, as shown in FIG. 3E, the p-side transparent wiring electrode layer40 and the n-side transparent wiring electrode layer 41 are formed in apredetermined region on the surface of the first reelecting layer 50 atthe same time. At the time, a part of the p-side transparent wiringelectrode layer 40 enters into the p-side first insulating film opening55 and a part of the n-side transparent wiring electrode layer 41 entersinto the n-side first insulating film opening 56 so as to come intocontact with the p-side transparent contact electrode 30 or the n-typesemiconductor layer 21 respectively.

In the embodiment. the p-side transparent wiring electrode layer 40 isformed of the same material as that of the n-side transparent wiringelectrode layer 41. and as the material. ITO is used. The p-sidetransparent wiring electrode layer 40 and the n-side transparent wiringelectrode layer 41 are formed by using, for example, the sputteringmethod. Further, the p-side transparent wiring electrode layer 40 andthe n-side transparent wiring electrode layer 41 can be also formed bythe vacuum deposition method, the CVD method. the deposition method. thesol-gel process or the like.

Then, as shown in FIG. 3F, each of the p-side wiring electrode layer 70and the n-side wiring electrode layer 71 is formed in a predeterminedpartial region of the surfaces of the p-side transparent wiringelectrode layer 40 and the n-side transparent wiring electrode layer 41at the same time by using the vacuum deposition method and thephotolithography technique.

Then, the insulating film 61 of the second reflecting layer 60 is formedby the plasma CVD method or the deposition method throughout thesurface. In particular, the insulating film 61 is formed by the plasmaCVD method or the like so as to cover the p-side wiring electrode layer70, the n-side wiring electrode layer 71, the p-side transparent wiringelectrode layer 40, the n-side transparent wiring electrode layer 41,(the exposed part of the n-side contact layer) and the first reflectinglayer 50 (Third insulating layer forming step in insulating layerforming step).

Then, as shown in FIG. 3G. the reflecting layer 62 of the secondreflecting layer 60 is formed above the p-side first insulating filmopening 55 and the n-side first insulating film opening 56 by using thedeposition method or the plasma CVD method so as to cover the p-sidefirst insulating film opening 55 and the n-side first insulating filmopening 56 (Second reflecting layer forming step in insulating layerforming step).

Then, the insulating film 61 of the second reflecting layer 60 is formedagain by the plasma CVD method or the deposition method throughout thesurface (Fourth insulating layer forming step in insulating layerforming step). Hereby, the reflecting layer 62 is covered with theinsulating film 61. Then, as shown in FIG. 3H, patterning is applied tothe insulating film 61 and the reelecting layer 62 so as to form thep-side second insulating film opening 65 and the n-side secondinsulating film opening 66.

Then, as shown in FIG. 31. the p-side electrode 80 and the n-sideelectrode 81 are formed at the same time via each of the p-side secondinsulating film opening 65 and the n-side second insulating film opening66 and so as to cover the openings 65, 66 by using the vacuum depositionmethod and the photolithography technique (External electrode formingstep). The p-side electrode 80 formed in the p-side second insulatingfilm opening 65 is electrically connected to the p-side wiring electrodelayer 70, and simultaneously the n-side electrode 81 formed in then-side second insulating film opening 66 is electrically connected tothe n-side wiring electrode layer 71. Via the above-mentioned steps, thelight emitting element 1 is manufactured.

The light emitting element 1 manufactured via the above-mentioned stepsis mounted by a flip-chip bonding on a predetermined location of awiring substrate including ceramic or the like in which a wiring patternof a conductive material is preliminarily formed. Then, the lightemitting element 1 mounted on the substrate is integrally sealed with asealing material such as epoxy resin, silicone resin, glass, so that thelight emitting element 1 can be packaged as a light emitting device.

Operation

The light emitting element 1 emits a light from the light emitting layer22 by applying voltage to the p-side electrode 80 and the n-sideelectrode 81. A part of the light is emitted from the light emittinglayer 22 toward the side of sapphire substrate 10 that is a lightextracting direction, and the other part of the light is emittedlaterally or toward the side of p-side transparent contact electrode 30.

A part of the light emitted toward the side of p-side transparentcontact electrode 30 of the emission light of the emitting layer 22 isreflected to the light extracting direction by the first reflectinglayer 50. and the other part passes through the p-side first insulatingfilm opening 55 and is reflected to the light extracting direction bythe second reflecting layer 60.

Also, the light emitted toward the side of sapphire substrate 10 of theemission light may be reflected to the side of p-side transparentcontact electrode 30 by the interface between the GaN semiconductorlayer 20 and the sapphire substrate 10, but the light is also reflectedto the light extracting direction by the first reflecting layer 50 orthe second reflecting layer 60 after passing through the p-side firstinsulating film opening 55 and the n-side first insulating film opening56.

Effects of the First Embodiment

The light emitting element 1 according to the embodiment has a structurethat the contact electrode formed on the p-side contact layer of thep-type semiconductor layer 23 includes ITO transparent to the emissionlight, the first reflecting layer 50 is formed thereon, and further thesecond reflecting layer 60 is formed above the p-side first insulatingfilm opening 55 of the first reflecting layer 50 on which the p-sidetransparent wiring electrode layer 40 is formed, thereby the emissionlight can be reflected to the light extracting direction at high rateswithout absorbing the light by the p-side transparent contact electrode30, so as to enhance a light extraction efficiency of the emissionlight.

In addition, the p-side wiring electrode layer 70 and the n-side wiringelectrode layer 71 into which the emission light does not enter are notneeded to have a function of a reflecting layer, thus even if thereflectance thereof is low, it does not have a large influence on thelight extracting efficiency. Therefore, various materials having lowresistance can be selected as the p-side wiring electrode layer 70 andthe n-side wiring electrode layer 71. Accordingly, even if the sheetresistance of the transparent wiring electrode is high, carrierdiffusivity of the light emitting element 1 can be enhanced and thewhole driving voltage can be reduced.

In addition, even if the number of the p-side first insulating filmopening 55 and the n-side first insulating film opening 56 is increased,a part in which the reflectance of the emission light is low is notincreased and the emission area is not reduced. thus a plurality ofcontacts between the p-side transparent wiring electrode layer 40 andthe p-side transparent contact electrode 30. and a plurality of contactsbetween then-side transparent wiring electrode layer 41 and the n-typesemiconductor layer 21 can be formed while maintaining the lightintensity, so that the driving voltage can be reduced.

Second Embodiment

FIG. 4 is a plan view schematically showing a structure of a lightemitting element 1A according to a second embodiment of the presentinvention.

The light emitting element 1A has a structure that the p-sidetransparent contact electrode 30 of the light emitting element 1according to the first embodiment is changed to the p-side contactelectrode 32 including a high reflective material such as Ag, Rh beingnot transparent, and an insulating film 53 that does not have areflective layer is formed instead of the first reflecting layer 50 ofthe first embodiment. Namely, in the light emitting element 1A, thep-side contact electrode 32 functions as the first reflecting layer.

In addition, a region in which a part of the n-type semiconductor layer21 is exposed functions as the openings.

Operation

The light emitting element 1A emits a light from the light emittinglayer 22 by applying voltage to the p-side electrode 80 and the n-sideelectrode 81. A part of the light is emitted from the light emittinglayer 22 toward the side of sapphire substrate 10 that is a lightextracting direction, and the other part of the light is emitted towardthe side of p-side contact electrode 32.

The light emitted toward the side of p-side contact electrode 32 isreelected to the side of sapphire substrate 10 by the surface of thep-side contact electrode 32. Also, a part of the light emitted towardthe side of sapphire substrate 10 is reflected to the mesa portion orthe n-side contact layer by the interface between the GaN semiconductorlayer 20 and the sapphire substrate 10 so as to be reflected to thelight extracting direction by the reflecting layer 62 of the secondreflecting layer 60.

Effects of the Second Embodiment

The light emitting element 1A according to the embodiment has astructure that the n-side transparent wiring electrode layer 41 formedon the n-side contact layer of the n-type semiconductor layer 21includes ITO transparent to the emission light, and the secondreelecting layer 60 is formed thereon. thereby the emission light can bereelected to the light extracting direction at high rates withoutabsorbing the light by the n-side transparent wiring electrode layer 41,so as to enhance a light extraction efficiency of the emission light.

Third Embodiment

FIG. 5 is a plan view schematically showing a structure of a lightemitting element 1B according to a third embodiment of the presentinvention.

The light emitting element 1B differs from the light emitting element 1according to the first embodiment in having a structure that the n-sidecontact electrode 31 is formed between the n-side contact layer of then-type semiconductor layer 21 and the n-side transparent wiringelectrode layer 41. The n-side contact electrode 31 is formed of amaterial having conductive property and translucency to a wavelength ofa light emitted from the light emitting layer 22, and is formed of thesame electrode material as that of the n-side transparent wiringelectrode layer 41. The n-side contact electrode 31 is formed of, forexample, ITO.

As shown in FIG. 5, one surface of the n-side contact electrode 31 comesinto contact with the n-side transparent wiring electrode layer 41, andanother surface comes into contact with the n-type semiconductor layer21 so as to be electrically connected to each other.

Operation

A part of the light emitted toward the side of p-side transparentcontact electrode 30 of the emission light is reflected to the lightextracting direction by the first reelecting layer 50, and the otherpart passes through the p-side first insulating film opening 55 so as tobe reelected to the light extracting direction by the second reflectinglayer 60. Also, a part of the light emitted toward the side of sapphiresubstrate 10 of the emission light is reelected by the interface betweenthe GaN semiconductor layer 20 and the sapphire substrate 10. andfurther a part thereof passes through the n-side contact electrode 31 soas to be reflected to the light extracting direction by the firstreflecting layer 50 or second reelecting layer 60.

Effects of the Third Embodiment

The light emitting element 1B according to the embodiment has astructure that the contact electrodes formed on the contact layers ofthe p-side contact layer of the p-type semiconductor layer 23 and then-type semiconductor layer 21 include a material transparent to theemission light, the first reflecting layer 50 is formed thereon, andfurther the second reelecting layer 60 is formed above the p-side firstinsulating film opening 55 and the n-side first insulating film opening56, thereby the emission light can be reflected to the light extractingdirection at high rates without absorbing the light by the p-sidetransparent contact electrode 30 or the n-side contact electrode 31. soas to enhance a light extraction efficiency of the emission light. Inaddition, the n-side contact electrode 31 and the n-side transparentwiring electrode layer 41 are formed separately, consequently a hightemperature treatment applying heat to the n-side contact electrode 31is carried out after the n-side contact electrode 31 has been formed andbefore the first reflecting layer 50 is formed, thereby contactresistance between the n-side contact electrode 31 and the n-typesemiconductor layer 21 can be reduced without damaging the firstreflecting layer 50 due to heat.

Although the invention has been described with respect to the specificembodiments for complete and clear disclosure. the appended claims arenot to be thus limited but are to be construed as embodying allmodifications and alternative constructions that may occur to oneskilled in the art which fairly, fall within the basic teaching hereinset forth. The entire contents of patents or publications of patentapplications exhibited herein are incorporated herein by reference.

What is claimed is:
 1. A light emitting element, comprising: asemiconductor laminate structure comprising a first semiconductor layerof a first conductivity type, a light emitting layer, and a secondsemiconductor layer of a second conductivity type different from thefirst conductivity type, a part of the second semiconductor layer andthe light emitting layer being removed to expose a part of the firstsemiconductor layer; a first reelecting layer on the semiconductorlaminate structure and comprising an opening, the opening being formedin the exposed part of the first semiconductor layer: a transparentwiring electrode for carrier injection into the first semiconductorlayer or the second semiconductor layer through the opening; and asecond reflecting layer formed on the transparent wiring electrode andcovering a part of the opening so as to reflect light emitted from thelight emitting layer and passing through the opening back to the firstsemiconductor layer.
 2. The light emitting element according to claim 1,further comprising: a contact electrode comprising a transparentconducting layer, one surface of which contacts the transparent wiringelectrode and an other surface of which contacts the first semiconductorlayer or the second semiconductor layer.
 3. The light emitting elementaccording to claim 2, wherein the contact electrode comprises a sameelectrode material as the transparent wiring electrode.
 4. The lightemitting element according to claim 2, wherein the first reflectinglayer is formed on a part of the contact electrode of the firstsemiconductor layer or the second semiconductor layer.
 5. The lightemitting element according to claim 1, further comprising: an insulatinglayer formed in between the first reflecting layer and the secondreflecting layer and/or in between the first reflecting layer and thetransparent wiring electrode.
 6. The light emitting element according toclaim 1, further comprising: a metallic wiring electrode formed at aregion on the first reflecting layer and except the opening, andelectrically connected to the transparent wiring electrode.
 7. The lightemitting element according to claim 1, wherein the first reelectinglayer comprises a contact electrode of the second semiconductor layer.8. The light emitting element according to claim
 7. wherein thetransparent wiring electrode contacts the first semiconductor layer. 9.The light emitting element according to claim 7, wherein a contactelectrode of the first semiconductor layer comprises a transparentconducting layer. and the transparent wiring electrode contacts thetransparent conducting layer.
 10. The light emitting element accordingto claim 1, wherein the light emitting element is of a flip-chip type soas to extract light emitted from the light emitting layer in a directionof across the semiconductor laminate structure from the first reflectinglayer or the second reflecting layer.
 11. The light emitting elementaccording to claim 10, wherein the first reflecting layer comprises acontact electrode of the second semiconductor layer.
 12. The lightemitting element according to claim 11, wherein the transparent wiringelectrode contacts the first semiconductor layer.